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Effect of bismuth addition on the corrosion dynamics of Sn\3Ag\0.5Cu solder alloy in Hydrochloric Acid Solution    
Yazarlar (1)
Doç. Dr. Ahmet Mustafa ERER Doç. Dr. Ahmet Mustafa ERER
Karabük Üniversitesi, Türkiye
Devamını Göster
Özet
This study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn–3.0Ag–0.5Cu (SAC 305) solder alloy in
1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy
dispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate
that the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a
true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive
region does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1
wt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement
of silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and
stability of protective passive corrosion products.
Anahtar Kelimeler
Makale Türü Özgün Makale
Makale Alt Türü Ulusal alan endekslerinde (TR Dizin, ULAKBİM) yayımlanan tam makale
Dergi Adı International Journal of Innovative Engineering Applications
Dergi ISSN 2587-1943
Dergi Tarandığı Indeksler TR DİZİN
Makale Dili İngilizce
Basım Tarihi 06-2021
Cilt No 5
Sayı 1
Sayfalar 40 / 44
Doi Numarası 10.46460/ijiea.911862
Makale Linki http://dx.doi.org/10.46460/ijiea.911862