| Makale Türü |
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| Dergi Adı | Engineering Science and Technology an International Journal (Q1) | ||
| Dergi ISSN | 2215-0986 Dergi Bilgileri (2020) | ||
| Dergi Tarandığı Indeksler | SCI-Expanded | ||
| Makale Dili | İngilizce | Basım Tarihi | 08-2020 |
| Kabul Tarihi | – | Yayınlanma Tarihi | 01-08-2020 |
| Cilt / Sayı / Sayfa | 23 / 4 / 812–820 | DOI | 10.1016/j.jestch.2020.06.006 |
| Makale Linki | https://linkinghub.elsevier.com/retrieve/pii/S2215098620305334 | ||
| UAK Araştırma Alanları |
Tesisat Teknolojisi
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| Özet |
| The purpose of this study is to experimentally investigate thermal performance of Two Phase Closed Thermosyphon (TPCT) using nanofluid containing CuO nanoparticles at a mass concentration of 1% and 2% wt. For this purpose, an experimental setup was designed and manufactured which contains a copper pipe, 100 cm in length and 18 mm in the inner diameter. TPCT consists of three sections: the evaporator section (40 cm), adiabatic section (20 cm) and condenser section (40 cm). The evaporator section was wrapped with electrical spiral heater to apply heat, and whole section of TPCT was insulated. A cooling water circuit was used to remove the heat from condenser section. The temperatures were measured on the TPCT surface and cooling water inlet and outlet. The inclination angle of the TPCT was fixed at 90°. The effects of various parameters such as heat load (ranging from 200 to 800 W), cooling … |
| Anahtar Kelimeler |
| CuO/water | Heat pipe | Nanofluid | Thermal performance | Two-phase closed thermosyphon |
| Atıf Sayıları | |
| Web of Science | 25 |
| Scopus | 28 |
| Google Scholar | 37 |
| Dergi Adı | Engineering Science and Technology-An International Journal-JESTECH |
| Kısa Adı | ENG SCI TECHNOL |
| Yayıncı | ELSEVIER - DIVISION REED ELSEVIER INDIA PVT LTD |
| Açık Erişim | Evet |
| ISSN | 2215-0986 |
| E-ISSN | 2215-0986 |
| Wos Quartile | Q1 |
| Scopus Quartile | Q1 |
| Tarandığı Indeksler | SCIE , Scopus |
| WoS Kategoriler | ENGINEERING, MULTIDISCIPLINARY |
| Scopus Kategoriler | CIVIL AND STRUCTURAL ENGINEERING | COMPUTER NETWORKS AND COMMUNICATIONS | ELECTRONIC, OPTICAL AND MAGNETIC MATERIALS | FLUID FLOW AND TRANSFER PROCESSES | HARDWARE AND ARCHITECTURE | MECHANICAL ENGINEERING | METALS AND ALLOYS | BIOMATERIALS |